RESEARCH OF FACTORS INFLUENCING THE PROCESS OF FORMATION OF WELDED MICROCONNECTIONS IN ELECTRONIC MODULES

Authors : İgor NEVLİUDOV, Murad OMAROV, İryna BOTSMAN, Nataliia DEMSKA, Viktoriia NEVLİUDOVA, Mykola STARODUBCEV

Pages : 181-187

Doi:10.18038/estubtda.651032

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Publication Date : 2019-12-16

Article Type : Research Paper

Abstract :The features of the formation of microconnections in electronic modules on an aluminum-polyimide basis by the method of ultrasonic welding, which allows to obtain reliable mounting joints of different thickness aluminum without preliminary removal of oxide films where the use of contact welding and soldering are practically difficult or impossible, are investigated.  The influence of technological modes insert ignore into journalissuearticles values(power of an ultrasonic generator, oscillation amplitude of a welding tip insert ignore into journalissuearticles values(tool);, welding force and welding time); on the reliability of mounting microconnections is considered
Keywords : electronic modules, microconnection, polyimide, ultrasonic welding