EFFECT OF DRYING TYPES AND POLYSTYRENE DENSITY ON THERMAL CONDUCTIVITY OF POLYSTYRENE COMPOSITE PARTICLEBOARD

Authors : Hasan ÖZTÜRK, Gürsel ÇOLAKOĞLU, Cenk DEMİRKIR

Pages : 57-62

View : 50 | Download : 11

Publication Date : 2019-12-25

Article Type : Conference Paper

Abstract :Thermal conductivity of wood material is superior to other building materials because of its porous structure. Thermal conductivity is a very important parameter in determining heat transfer rate and is required for development of drying models in industrial operations such as adhesive cure rate. Thermal conductivity is used to estimate the ability of insulation of material. Thermal conductivity of wood material has varied according to wood species, direction of wood fiber, resin type, and addictive members used in manufacture of wood composite panels. The aim of the study is to produce a new wood composite material with insulating properties by using insulating material called as polystyrene instead of formaldehyde based adhesives as bonding material. Five different wood species insert ignore into journalissuearticles values(beech, poplar, alder, pine, spruce);, six different polystyrene species with different density values were used in this study and three layers particleboard in 18 mm thickness was produced. Urea formaldehyde resin insert ignore into journalissuearticles values(UF); was used in conventional panels manufacturing as adhesive. Technical drying was applied half of the test groups, while the other group was conditioned until reach to 12% equilibrium moisture content at room temperature as natural before manufacturing process to determine the effect of drying. The thermal conductivity of new composite panels were determined according to ASTM C 518 & ISO 8301.  According to the results from the study, thermal conductivity values obtained from natural drying were found to be higher than technical drying. The type of binder that gives the lowest thermal conductivity values among tree species in natural drying is generally S5. The lowest values in technical drying were obtained from panels bonded with XPS. 
Keywords : Thermal Conductivity, Polystyrene Composite Particleboard, Drying Types

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