Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

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Politeknik Dergisi
Volume:21 Issue:3
Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

Pages : 587-589

View : 42 | Download : 18

Publication Date : 2018-09-01

Article Type : Research Paper

Abstract :In this study, effect of melting temperatures of Sn-3Ag insert ignore into journalissuearticles values(SAC300);, Sn-3Ag -0.5Cu insert ignore into journalissuearticles values(SAC305); and Sn-0.3Ag-0.7Cu insert ignore into journalissuearticles values(SAC0307); ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures insert ignore into journalissuearticles values(250, 280 and 310 ℃ );. The melting temperatures of alloys were examined by differential scanning calorimeter insert ignore into journalissuearticles values(DSC); that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 ° at 310 ℃ on Cu substrate.
Keywords : Contact angle, melting temperature, wettability

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