Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate

Authors : Okan UYANIK, Ahmet Mustafa ERER, Yunus TÜREN

Pages : 1-7

Doi:10.31202/ecjse.441434

View : 34 | Download : 7

Publication Date : 2019-01-31

Article Type : Research Paper

Abstract :This study reports the investigation on indium addition into Sn–3Ag-0.5Cu ternary lead-free solder to improve its various performances. The effects of indium addition on wettability of the solder alloy was studied. The results showed that when the addition of indium was 1 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In solder was negligible, but the contact angles insert ignore into journalissuearticles values(θ); of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures insert ignore into journalissuearticles values(250, 280 and 310 °C); on Cu substrate in Ar atmosphere.  Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The lowest θ was obtained as 35,55°for Sn–2Ag-0.5Cu–1In  alloy at 310 °C.  The formation of intermetallic compounds insert ignore into journalissuearticles values(IMC); between the Pb-free solder alloys and the Cu substrate was observed. As a result, the studies show that the wetting capability of Sn–2Ag-0.5Cu–1In quaternary alloy is better than Sn–3Ag-0.5Cu ternary alloy.
Keywords : Islatabilirlik, Kurşunsuz Lehim Alaşımları, Temas Açısı

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